The **ATS-01B-07-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for the thermal management of integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ## 🛠️ Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | blueICE™ | | **Heat Sink Type** | Push-Pin (BGA) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 16.97°C/W (@ Natural Convection) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material** | T412 (Double-Sided Tape/Pad) | --- ## 🔍 Key Component Features ### 1. Fin Design The "07" in the part number typically refers to the fin configuration. These are usually **straight-fin** or **cross-cut** designs optimized for longitudinal airflow. The aluminum construction ensures rapid heat dissipation from the component surface to the surrounding air. ### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-only heat sinks, the **R0** suffix indicates a push-pin attachment system. * **Spring-loaded pins:** These provide consistent pressure (clip load) across the chip surface. * **Reliability:** This method is preferred in high-vibration environments (like industrial servers) where adhesive might fail over time. ### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **T412 thermal tape**. * It eliminates the need for messy thermal grease. * It provides high dielectric strength and low thermal impedance. --- ## 📈 Performance Context The effectiveness of this heat sink is highly dependent on **Airflow Velocity (LFM - Linear Feet per Minute)**: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.20 | | 400 (2.0 m/s) | 4.10 | | 600 (3.0 m/s) | 3.20 | --- ## 🏗️ Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01B** | Series/Base Geometry | | **07** | Height/Fin pattern code | | **C3** | Thermal Interface Material (T412) | | **R0** | Revision/Specific Packaging format |