ATS-01B-10-C2-R0
AI

The **ATS-01B-10-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series of high-performance heat sinks.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink (Thermal Management) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | superGRIP (Clip-on) |
| **Thermal Resistance** | 3.2°C/W (at 200 LFM) |
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## 2. Component Breakdown
### A. Material and Coating
The part is made of **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just aesthetic; it provides:
* Increased corrosion resistance.
* Improved surface emissivity for better radiant heat transfer.
* Electrical insulation on the surface of the aluminum.
### B. The superGRIP™ Attachment System
This is the most critical "electronic part" aspect of the component. Unlike heat sinks that require holes drilled into the PCB, this uses a high-strength clip system:
1. **Frame Clip:** A plastic frame that snaps onto the perimeter of the electronic component (usually a BGA/FPGA).
2. **Spring Clip:** A "C-shaped" metal spring that provides consistent downward pressure, ensuring a tight thermal interface between the chip and the heat sink.
### C. Thermal Performance
The straight fin design is optimized for **forced air cooling**. It is designed to dissipate heat from high-performance integrated circuits like:
* Processors (CPUs/GPUs).
* FPGAs.
* Application-Specific Integrated Circuits (ASICs).
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## 3. Part Number Nomenclature
Understanding the code **ATS-01B-10-C2-R0**:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **01B:** Series designation (superGRIP).
* **10:** Specific dimension/fin geometry profile.
* **C2:** Thermal Interface Material (TIM) type (typically indicates a pre-applied Phase Change Material).
* **R0:** Revision code or packaging standard.
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- ⤷What is the maximum power dissipation (Watts) this heat sink can handle?
- ⤷ Does this model come with a pre-applied thermal interface material?
- ⤷ What are the compatible BGA package sizes for the ATS-01B-10-C2-R0?