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  • ATS-01B-10-C2-R0

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    The **ATS-01B-10-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series of high-performance heat sinks. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Thermal Management) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | 3.2°C/W (at 200 LFM) | --- ## 2. Component Breakdown ### A. Material and Coating The part is made of **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity for better radiant heat transfer. * Electrical insulation on the surface of the aluminum. ### B. The superGRIP™ Attachment System This is the most critical "electronic part" aspect of the component. Unlike heat sinks that require holes drilled into the PCB, this uses a high-strength clip system: 1. **Frame Clip:** A plastic frame that snaps onto the perimeter of the electronic component (usually a BGA/FPGA). 2. **Spring Clip:** A "C-shaped" metal spring that provides consistent downward pressure, ensuring a tight thermal interface between the chip and the heat sink. ### C. Thermal Performance The straight fin design is optimized for **forced air cooling**. It is designed to dissipate heat from high-performance integrated circuits like: * Processors (CPUs/GPUs). * FPGAs. * Application-Specific Integrated Circuits (ASICs). --- ## 3. Part Number Nomenclature Understanding the code **ATS-01B-10-C2-R0**: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **01B:** Series designation (superGRIP). * **10:** Specific dimension/fin geometry profile. * **C2:** Thermal Interface Material (TIM) type (typically indicates a pre-applied Phase Change Material). * **R0:** Revision code or packaging standard. ---
    ✨ Follow-up Questions
    • ⤷What is the maximum power dissipation (Watts) this heat sink can handle?
    • ⤷ Does this model come with a pre-applied thermal interface material?
    • ⤷ What are the compatible BGA package sizes for the ATS-01B-10-C2-R0?