The **ATS-01B-100-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical part of electronic thermal management systems, specifically designed for cooling high-power semiconductors and ICs. ### 1. Component Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 4.84°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Electronic & Design Features #### A. Thermal Management Strategy The part uses a **Straight Fin** design. In electronics, this is optimized for "impingement cooling" or high-velocity airflow. The 25mm height provides a significant surface area to dissipate heat from components like CPUs, GPUs, or high-power MOSFETs. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **-R0** suffix indicates a mechanical attachment system: * **Compression Springs:** Provide a precise, pre-calculated pressure to the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). * **Plastic/Brass Pins:** These pass through pre-drilled holes in the Printed Circuit Board (PCB) for a secure, vibration-resistant fit. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal grease. This eliminates the air gap between the heat source (electronic die) and the aluminum base, maximizing heat transfer. --- ### 3. Application Use Cases This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed switching ASICs. 2. **Embedded Systems:** Industrial PCs where high vibrations might cause adhesive heat sinks to fall off. 3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs). ---