The **ATS-01B-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series designed specifically for cooling electronic components such as processors, FPGAs, and high-power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 6.69°C/W (Natural Convection) | | **Attachment Method** | Push-Pin | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management Strategy This part is designed for **forced air** and **natural convection** environments. The "Straight Fin" design allows for low pressure drop, making it efficient for cooling high-heat dissipation components on a PCB. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the ATS-01B-101-C2-R0 uses a **Push-Pin** system with a brass or plastic pin and a compression spring. - **Reliability:** Provides constant pressure to ensure the thermal interface material (TIM) remains in contact with the chip. - **Safety:** Prevents the heat sink from shifting during high-vibration or mechanical shock. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the component, significantly reducing the thermal resistance across the interface. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific configuration: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01B** | Push-Pin Series | | **101** | Specific sizing/geometry code (45x45x20mm) | | **C2** | Thermal Performance/Material grade | | **R0** | Revision/Packaging standard | --- ### 4. Typical Applications * **Networking Devices:** Routers and Switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed memory modules.