The **ATS-01B-134-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70.00 mm x 70.00 mm x 15.00 mm | | **Attachment Type** | pushPIN™ | | **Thermal Resistance (Unducted Flow)** | 4.44 °C/W @ 100 LFM | | **Thermal Resistance (Ducted Flow)** | 1.78 °C/W @ 100 LFM | | **Mounting Hole Pattern** | 63.00 mm x 63.00 mm | | **Spring Type** | ATS-PPS-01 | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System This heat sink utilizes a specialized push-pin mechanism. This allows for: * **Quick Installation:** Secure attachment with minimal tools. * **Constant Pressure:** The compression springs ensure a consistent force between the heat sink and the electronic component for optimal heat transfer. #### B. Cross-Cut Fin Design The fin structure is designed to be "cross-cut." This allows air to flow through the fins from multiple directions, making it more effective in systems where airflow may be turbulent or non-linear. #### C. Blue Anodized Finish The anodized layer is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Improved Emissivity:** Slightly enhances radiant heat dissipation compared to raw aluminum. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01**: Series type. * **B**: Attachment variation (Push-pin style). * **134**: Specific size/profile identifier. * **C2**: Thermal Interface Material (TIM) and finish code (typically indicates a pre-applied T766 phase change material or similar). * **R0**: Revision code. --- ### 4. Application Use Cases This heat sink is typically found in: * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Dissipating heat from high-speed ASICs. * **Power Electronics:** Managing heat for large voltage regulators or transistors.