The **ATS-01B-135-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 3.00°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 15mm x 40mm x 20mm | | **Fin Type** | Fine Pitch (Straight) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by ATS to define the product's attributes: * **ATS-01**: Refers to the product series and base configuration. * **B**: Denotes the specific revision or mechanical variation. * **135**: A internal sequence/size identifier (corresponds to the 15x40x20mm footprint). * **C2**: Indicates the **Thermal Interface Material (TIM)** and finish. "C2" typically implies the heat sink comes with pre-applied **T766 phase change material** or high-performance thermal grease. * **R0**: Refers to the RoHS compliance status and revision level. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), it serves critical functions in an electronic circuit: 1. **Thermal Dissipation**: It increases the surface area of the heat-generating component, allowing air to carry away heat more efficiently via convection. 2. **Reliability Enhancement**: By maintaining the junction temperature ($T_j$) of semiconductors within safe limits, it extends the Mean Time Between Failures (MTBF). 3. **Push-Pin Mounting**: The "pushPIN™" system uses a flexible spring-loaded mechanism. This ensures even pressure across the electronic chip, which optimizes the contact between the component and the heat sink for better heat transfer. --- ### 4. Typical Applications * **Embedded Systems**: Cooling small processors in industrial controllers. * **Telecommunications**: Heat management for high-speed networking chips. * **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators.