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  • ATS-01B-15-C2-R0

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    The **ATS-01B-15-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blue-ice™** series of high-performance heat sinks. --- ## 1. Technical Specifications This part is a high-performance heat sink designed for electronic components such as CPUs, GPUs, or power transistors that require efficient thermal management. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01B-15-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | ~5.80°C/W (at 200 LFM) | | **Airflow Strategy** | Cross-cut (Multiple Fin Directions) | --- ## 2. Key Features ### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the "R0" designation usually refers to the **pushPIN™** system. This involves: * **Compression Springs:** Provides precise pressure to ensure maximum contact between the heat sink and the component. * **Plastic/Brass Pins:** Secure the sink to pre-drilled holes in the PCB. ### B. Material & Coating * **Aluminum 6063:** Provides a balance between thermal conductivity and weight. * **Blue Anodized Finish:** Not only aesthetic but also increases surface emissivity and provides corrosion resistance. ### C. Fin Design The heat sink utilizes a **cross-cut** pattern. This allows for airflow from any direction (omni-directional), making it ideal for crowded PCBs where the air direction might be turbulent or inconsistent. --- ## 3. Applications The ATS-01B-15-C2-R0 is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and motor drivers. --- ## 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Brand). * **01:** Series indicator. * **B:** Material/Fin style code. * **15:** Height of the heat sink (15mm). * **C2:** Thermal Interface Material (TIM) type/Anodization code. * **R0:** Revision or specific packaging/attachment version.
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ How do I calculate the required airflow (LFM) for this specific thermal resistance?
    • ⤷ Are there CAD files or footprints available for the PCB mounting holes?