ATS-01B-15-C2-R0
AI

The **ATS-01B-15-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blue-ice™** series of high-performance heat sinks.
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## 1. Technical Specifications
This part is a high-performance heat sink designed for electronic components such as CPUs, GPUs, or power transistors that require efficient thermal management.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-01B-15-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm |
| **Thermal Resistance** | ~5.80°C/W (at 200 LFM) |
| **Airflow Strategy** | Cross-cut (Multiple Fin Directions) |
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## 2. Key Features
### A. pushPIN™ Attachment
Unlike adhesive tapes or simple clips, the "R0" designation usually refers to the **pushPIN™** system. This involves:
* **Compression Springs:** Provides precise pressure to ensure maximum contact between the heat sink and the component.
* **Plastic/Brass Pins:** Secure the sink to pre-drilled holes in the PCB.
### B. Material & Coating
* **Aluminum 6063:** Provides a balance between thermal conductivity and weight.
* **Blue Anodized Finish:** Not only aesthetic but also increases surface emissivity and provides corrosion resistance.
### C. Fin Design
The heat sink utilizes a **cross-cut** pattern. This allows for airflow from any direction (omni-directional), making it ideal for crowded PCBs where the air direction might be turbulent or inconsistent.
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## 3. Applications
The ATS-01B-15-C2-R0 is typically found in:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Power Electronics:** Voltage regulators and motor drivers.
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## 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Brand).
* **01:** Series indicator.
* **B:** Material/Fin style code.
* **15:** Height of the heat sink (15mm).
* **C2:** Thermal Interface Material (TIM) type/Anodization code.
* **R0:** Revision or specific packaging/attachment version.
- ⤷
What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ How do I calculate the required airflow (LFM) for this specific thermal resistance?
- ⤷ Are there CAD files or footprints available for the PCB mounting holes?