The **ATS-01B-150-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blueICE" series, designed primarily for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Mounting Type** | Push-Pin | | **Thermal Resistance** | 4.82°C/W @ 200 LFM | | **Attachment Style** | Plastic Push-Pin with Brass Springs | --- ### 2. Component Breakdown #### A. Heat Sink Body * **Material:** Extruded aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Fin Design:** It features a "straight fin" or "cross-cut" pattern depending on the specific airflow requirement, designed to maximize surface area for heat dissipation into the surrounding air. * **Finish:** The **Blue Anodized** coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. #### B. Mounting System (Push-Pins) The "R0" suffix indicates the mounting hardware configuration. * **Push-Pins:** Plastic pins that snap into pre-drilled holes on a Printed Circuit Board (PCB). * **Springs:** Compression springs ensure a consistent "clamping force" (pressure) between the heat sink and the electronic chip, which is critical for minimizing thermal interface resistance. #### C. Thermal Interface Material (TIM) While usually ordered separately or pre-applied, these heat sinks are designed to be used with: * **Phase-change materials** or **Thermal grease** to fill microscopic air gaps between the component and the heat sink base. --- ### 3. Thermal Performance Metrics The effectiveness of the ATS-01B-150-C2-R0 is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | Unducted (Natural) | 4.82 | | 300 LFM | 2.40 | | 500 LFM | 1.60 | --- ### 4. Part Number Decoder Understanding the "ATS-01B-150-C2-R0" nomenclature: * **ATS:** Manufacturer prefix. * **01B:** Series/Family design. * **150:** Specific dimension/geometry code. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Hardware revision (Push-pin type and quantity).