The **ATS-01B-166-C1-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-01B-166-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material (TIM)** | No TIM (C1 series) | | **Fin Style** | Straight Fin | | **Flow Orientation** | Vertical / Horizontal | --- ### 2. Key Component Features #### A. Material and Finish The unit is constructed from **6063 aluminum**, which offers an excellent balance between thermal conductivity and weight. The **Blue Anodized** coating is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity (helping slightly with radiative cooling). * Electrical insulation on the surface of the fins. #### B. Attachment Mechanism: Push-Pins Unlike adhesive-based heat sinks, the "01B" designation indicates a **Push-Pin** mounting system. * **Plastic Push-Pins:** Provide a secure, mechanical connection to the PCB. * **Built-in Springs:** These ensure constant pressure (Force) between the heat sink and the component, which is critical for minimizing thermal resistance at the contact point. #### C. Thermal Performance The "166" in the part number refers to the specific fin density and geometry. This model features a **Straight Fin** design, which is optimized for: 1. **Forced Convection:** Works best when there is an active fan blowing air across the fins. 2. **Low Pressure Drop:** Allows air to pass through with minimal resistance compared to cross-cut or pin-fin designs. --- ### 3. Application Use-Cases This specific heat sink is typically found in the following electronic environments: * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs where mechanical stability (via push-pins) is required due to vibration. * **Power Electronics:** Cooling MOSFET arrays or voltage regulator modules (VRMs). ---