The **ATS-01B-17-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is part of the "pushPIN™" thermal management line manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Product Type** | Heat Sink (Thermal Management) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | pushPIN™ | | **Thermal Resistance** | 15.44 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 12.70 mm | | **Fin Style** | Straight Fin | | **Flow** | XC (Cross-cut) / Omni-directional | --- ### 2. Key Electronic Features #### A. Attachment Mechanism (pushPIN™) The "01B" in the part number indicates the specific push-pin attachment system. This is designed for: * **Ease of Assembly:** It uses a flexible, spring-loaded pin mechanism to secure the sink to the Printed Circuit Board (PCB). * **Reliability:** Provides consistent pressure on the electronic component (CPU, GPU, or FPGA), ensuring optimal thermal interface material (TIM) performance. #### B. Thermal Performance This heat sink is designed to dissipate heat from high-power electronic components. The **12.70 mm height** makes it a "low-profile" solution, ideal for thin rack-mounted servers or compact industrial electronics. #### C. Material and Coating * **Aluminum 6063:** Chosen for high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 3. Application Use Cases The ATS-01B-17-C2-R0 is typically used on the following electronic components: 1. **Microprocessors/CPUs:** For embedded systems where vertical space is limited. 2. **ASICs & FPGAs:** Used in networking hardware (routers/switches) to cool custom silicon. 3. **Power Electronics:** Cooling large MOSFET arrays or power converters. --- ### 4. Thermal Resistance Data Heat sinks perform differently based on the air velocity (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 15.44 | 6.31 | 3.73 | 2.84 | ---