The **ATS-01B-185-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Anodized" series designed for component-level cooling in electronics. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Resistance (Natural Flow)** | 7.62°C/W | | **Thermal Resistance (@ 200 LFM)** | 3.34°C/W | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. The Fin Design (High Performance) The ATS-01B-185-C2-R0 uses a **straight-fin** configuration. This design is optimized for environments with some level of airflow (forced convection), allowing air to pass through the channels and carry heat away from the base efficiently. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tape, this model features a **Push-Pin** system: * **Plastic Push-Pins:** These provide a secure mechanical connection to the PCB. * **Compression Springs:** These ensure constant downward pressure on the electronic component (CPU, GPU, or MOSFET), which is critical for maximizing heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. T766 is a phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance at the contact point. --- ### 3. Applications This specific heat sink is commonly used for cooling high-heat-density components such as: * **Application Specific Integrated Circuits (ASICs)** * **Field Programmable Gate Arrays (FPGAs)** * **Power Modules** * **Network Switches and Routers** --- ### 4. Part Number Breakdown The nomenclature tells us exactly what the part is: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **01:** Series Number * **B:** Material/Attachment Revision * **185:** Specific size and fin geometry code * **C2:** Thermal Interface Material type (T766) * **R0:** Packaging or Revision status