The **ATS-01B-197-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blueICE™ series, specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat-generating semiconductors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Characteristic | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Material** | Aluminum (Al) | | **Fin Style** | Straight Fin (Extruded) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 4.47 °C/W (at 200 LFM) | | **Finish** | Blue Anodized | | **Spring Type** | Stainless Steel (R0 suffix) | --- ### 2. Detailed Part Breakdown #### A. The pushPIN™ Attachment System The "R0" at the end of the part number signifies the specific attachment mechanism. - **Components:** It uses a spring-loaded pin (pushPIN™) to secure the heat sink to the PCB. - **Benefits:** Provides a precise and consistent pressure across the interface material, ensuring optimal heat transfer while preventing damage to the silicon die. #### B. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **ATS-51**, a high-performance thermal grease. This eliminates the need for manual paste application, ensuring a low thermal resistance path from the chip to the aluminum fins. #### C. Geometry and Airflow The straight fin design is optimized for **forced convection** (active airflow from a fan). The 20mm height provides a large surface area for heat dissipation without being too bulky for standard server or desktop chassis heights. --- ### 3. Common Applications Due to its 45mm x 45mm footprint, this heat sink is frequently used for: - **FPGA cooling:** High-gate-count chips requiring stable thermal management. - **Network Switches:** Cooling processors in routers and high-speed switching hardware. - **Embedded Computing:** Industrial PC modules where reliability is critical. --- ### 4. Thermal Performance Comparison | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 9.04 | | 200 | 4.47 | | 400 | 3.39 | | 600 | 2.89 |