The **ATS-01B-202-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary electronic and mechanical specifications for this specific part number: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 14.83 °C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Fin Type** | Straight Fin | --- ### 2. Breakdown of the Model Code The part number follows a specific nomenclature used by ATS to identify the physical characteristics: * **ATS-01**: Refers to the product series (Push-pin heatsinks). * **B**: Denotes the material/finish (Aluminum, Blue Anodized). * **202**: Represents the specific dimensions and fin geometry configuration. * **C2**: Indicates the specific Thermal Interface Material (TIM) and spring tension level. * **R0**: Refers to the RoHS compliance/revision status. --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic circuit is critical for the following reasons: #### A. Thermal Dissipation The main electronic purpose is to conduct heat away from a semiconductor junction. This prevents **Thermal Throttling** (where a processor slows down to reduce heat) and **Thermal Runaway** (where heat destroys the component). #### B. Attachment & Pressure The "Push-Pin" system provides consistent pressure across the surface of the chip. This is vital because uneven pressure can lead to air gaps, which act as insulators, causing the electronic component to overheat despite having a heatsink. #### C. Thermal Interface Material (T766) This part comes pre-applied with **T766 TIM**. In electronics, this material fills the microscopic imperfections between the chip surface and the heatsink base to maximize heat transfer efficiency. --- ### 4. Application Use Cases * **Embedded Systems:** Cooling microcontrollers and small-scale processors. * **Telecommunications:** Dissipating heat from high-speed network switches. * **Power Supplies:** Managing heat from MOSFETs or voltage regulators.