The **ATS-01B-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "blueICE" series, designed for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table summarizes the core electronic and physical properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance (Unducted)** | 22.58 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 4.41 °C/W @ 100 LFM | --- ### 2. Key Electronic Functions While the heat sink itself does not carry current, its electronic role is critical for the stability of the system: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or Power MOSFET), allowing the heat to be transferred to the surrounding air via convection. * **Operating Stability:** By maintaining a lower junction temperature ($T_j$), it prevents **thermal throttling** (where a chip slows its clock speed to reduce heat) and avoids permanent hardware failure. * **EMI Shielding (Incidental):** Because it is aluminum and often grounded via the PCB mounting, it can provide a minor degree of electromagnetic interference shielding for the component underneath. --- ### 3. Structural Design Features The "C3" and "R0" designations in the part number refer to specific build characteristics: 1. **Straight Fin Design:** The fins are aligned to allow air to flow through the sink efficiently, typically optimized for systems with a dedicated cooling fan or defined airflow path. 2. **Push-Pin Mounting:** This uses a spring-loaded mechanism that passes through pre-drilled holes in the PCB. This provides consistent pressure between the heat sink and the electronic chip, ensuring optimal thermal contact. 3. **Thermal Interface Material (TIM):** This specific model typically comes with **T412** or a similar pre-applied phase-change material or thermal tape to eliminate air gaps between the chip and the metal surface. --- ### 4. Part Number Breakdown To better understand the electronic context: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **35-35**: The footprint dimensions (35mm square). * **10**: The height (10mm), which is "low profile" for compact electronic enclosures. * **C3**: Indicates the specific thermal performance/material grade. * **R0**: RoHS (Restriction of Hazardous Substances) compliant, ensuring it meets environmental safety standards for electronic hardware.