The **ATS-01B-37-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) | | **Heat Sink Type** | Straight Fin | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Thermal Resistance** | 9.10 °C/W (at 100 LFM) to 1.71 °C/W (at 700 LFM) | | **Interface Material** | T766 (High-performance Phase Change Material) | --- ## 2. Component Breakdown This device consists of four main electronic packaging components: ### A. The Heat Sink Body The body is made of extruded aluminum. The "Straight Fin" design is optimized for **forced convection** (systems with fans). The vertical fins provide a large surface area for heat to dissipate into the passing air. ### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under heat, this part uses a mechanical spring-loaded pin. * **Benefits:** Ensures constant pressure on the chip for optimal thermal contact. * **Assembly:** Requires pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766**. * This is a phase-change material that fills microscopic air gaps between the component (the chip) and the heat sink. * It lowers the thermal contact resistance significantly compared to air. ### D. Springs and Pins The hardware is designed to provide specific force (measured in Newtons) to prevent the heat sink from shifting during vibration or shipping while ensuring the silicon die isn't crushed. --- ## 3. Applications This part is commonly used in the following electronic environments: * **Networking:** Cooling ASICs in switches and routers. * **Industrial PCs:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators. ---