The **ATS-01B-51-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "push-pin" attachment series designed for electronic thermal management. --- ### 1. Key Technical Specifications The part number encodes specific data regarding its physical dimensions, material, and thermal performance. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.62°C/W @ 100 LFM (Linear Feet per Minute) | | **Flow Orientation** | Omni-directional (Pin Fin design) | --- ### 2. Physical Design Features * **Pin Fin Geometry:** Unlike straight-fin heat sinks, this model uses a pin-fin array. This design is highly effective in environments where the direction of airflow is inconsistent or limited, as it offers low pressure drop and high surface area. * **Pre-applied Thermal Interface Material (TIM):** This specific "R0" version usually comes with **T766** thermal phase-change material or a high-performance tape, ensuring immediate conductivity upon installation. * **Push-Pin Mounting:** It uses a brass push-pin mechanism. This provides a precise, reliable force on the electronic component (CPU, GPU, or FPGA), ensuring consistent thermal contact without the need for adhesive. --- ### 3. Application Use Cases This component is typically found in industrial and computing hardware to cool: 1. **BGA Components:** Ball Grid Array chips that generate significant heat in small footprints. 2. **Network Switches:** High-speed data processing units. 3. **Power Supplies:** Cooling voltage regulators or power transistors. 4. **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-01B-51-C2-R0 depends heavily on the airflow (LFM) provided by the system's fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.62 | | 200 | 1.0 | 4.09 | | 300 | 1.5 | 3.25 | | 400 | 2.0 | 2.81 |