ATS-01B-52-C3-R0
AI

The part number **ATS-01B-52-C3-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height** | 25.00 mm |
| **Fin Pattern** | Fine Pitch (Straight Fin) |
| **Thermal Resistance** | ~10.00° C/W (at 100 LFM) |
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### 2. Breakdown of the Part Number
The alphanumeric string follows a specific coding convention used by ATS:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **01B**: Series identifier (specifically the pushPIN™ line).
* **52**: Specific thermal performance and geometry profile.
* **C3**: Indicates the Thermal Interface Material (TIM) and color. "C3" typically signifies a **T766 phase change material** or high-performance grease pre-applied.
* **R0**: Revision code / RoHS compliance status.
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### 3. Key Electronic Cooling Features
* **Enhanced Airflow:** The straight fin design is optimized for environments with consistent directional airflow.
* **Push-Pin Mounting:** Unlike adhesive-based sinks, the pushPIN™ system provides a reliable, high-pressure connection to the PCB, ensuring optimal heat transfer from the chip to the aluminum.
* **Pre-Applied TIM:** This part usually comes with a pre-applied Thermal Interface Material (TIM), which eliminates the need for manual thermal paste application during assembly.
* **Compression Springs:** The springs provide precise pressure to prevent mechanical stress on the electronic component while maintaining thermal contact.
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### 4. Typical Applications
This specific heat sink is commonly found in:
* **Networking Equipment:** Routers, switches, and gateways.
* **Embedded Systems:** Industrial motherboards and controllers.
* **Power Supplies:** Cooling voltage regulators or power transistors.
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What are the alternative mounting methods for ATS heat sinks?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to black?
- ⤷ Can this heat sink be used for passive cooling without a fan?