The **ATS-01B-57-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Passive/Active cooling compatible) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Straight Fin (Cross-cut) | | **Attachment Method** | Plastic Push-Pins with Brass Springs | | **Thermal Resistance** | ~13.16 °C/W (Unducted @ 200 LFM) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Cross-Cut) The "Straight Fin" design with cross-cuts allows for airflow from multiple directions. This is ideal for systems where the airflow direction is not strictly unidirectional, ensuring consistent cooling performance regardless of the fan orientation. ### B. Attachment Mechanism: Push-Pin & Spring Unlike adhesive-based heat sinks, the **ATS-01B-57-C2-R0** uses a mechanical push-pin system. * **Plastic Push-Pins:** Quick to install into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent pressure (TIM - Thermal Interface Material compression), ensuring maximum contact between the heat sink base and the electronic chip. ### C. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and light weight. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a small amount of electrical insulation and increases the surface emissivity, slightly improving radiation heat transfer. --- ### 3. Application Examples This specific size (40mm) is commonly used in: * **Network Switches/Routers:** Cooling the main processors. * **Industrial PCs:** Thermal management for embedded chipsets. * **FPGA Cooling:** Dissipating heat from high-speed programmable logic devices. --- ### 4. Part Number Breakdown Understanding the ATS nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions. * **01:** Series number. * **B:** Base material/type. * **57:** Specific dimension/footprint code. * **C2:** Thermal Interface Material (TIM) type (often indicates T766 or similar pre-applied phase change material). * **R0:** Revision code / RoHS compliant status.