The **ATS-01B-70-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It falls under the category of **Heat Sinks**, specifically designed for cooling high-performance semiconductors and integrated circuits (ICs). --- ### Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-01B-70-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive cooling component) | | **Attachment Method** | Push-Pin (Brass or Plastic pins with springs) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~14.00°C/W (Natural Convection) | --- ### Key Design Features #### 1. Heat Sink Geometry The "70" in the part number indicates a specific fin design and height. This model typically features a **straight-fin** or **cross-cut** design which allows for airflow from multiple directions, making it versatile for systems with varying fan placements. #### 2. Attachment System (Push-Pins) The "B" in the code refers to the attachment mechanism. * **Push-Pins:** These provide a secure, standardized mounting method. * **Spring-Loaded:** Each pin is equipped with a compression spring to ensure even pressure across the thermal interface material (TIM), preventing "hot spots" on the chip. #### 3. Thermal Performance The **C2** designation often relates to the thermal interface material or the specific height/width configuration. * **Active vs. Passive:** While it is a passive block of metal, its efficiency is highly dependent on the "LFM" (Linear Feet per Minute) of airflow provided by system fans. --- ### Component Applications This part is commonly found in the following electronic environments: * **Networking Equipment:** Cooling for ASICs in routers and switches. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where high-vibration resistance (provided by push-pins) is required. * **Telecommunications:** Used on PCBs where space is limited but thermal loads are high. --- ### Dimensional Overview | Dimension | Measurement | | :--- | :--- | | **Width x Length** | 45mm x 45mm (Standard footprint) | | **Height** | 15mm | | **Mounting Hole Pitch** | Standardized for common PCB layouts |