The **ATS-01B-73-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure reliability and performance. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 14.71°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | | **ROHS Status** | Compliant | --- ### 2. Key Features and Design #### A. pushPIN™ Attachment System The "01B" in the part number refers to the specific attachment mechanism. This system uses a pre-assembled brass push-pin with a compression spring. * **Benefits:** Provides a consistent, pre-determined pressure on the heat source, improving thermal interface material (TIM) performance. * **Security:** Prevents the heat sink from shifting during vibration or shipping. #### B. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from environmental degradation. * **Emissivity:** Slightly improves heat radiation compared to raw aluminum. #### C. Straight Fin Geometry The fins are arranged in a straight-line pattern. This design is optimized for **forced air cooling** (fans) where the airflow is directed along the channels between the fins. --- ### 3. Thermal Performance (Estimated) Thermal resistance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.71 | | 200 (1.0 m/s) | 5.42 | | 300 (1.5 m/s) | 3.12 | | 500 (2.5 m/s) | 2.02 | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs or networking hardware where space is limited (10mm height). ---