The **ATS-01B-82-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is not an active electronic chip (like a CPU), but rather a **Passive Thermal Management Component** designed to cool surface-mount devices. --- ### 1. Technical Specifications This part belongs to the **pushPIN™ Heat Sink** series. Below are the primary technical characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.92 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (Fin Height)** | 25.00mm | | **Pitch** | Fine-Pitch | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01**: Series type (pushPIN™). * **B**: Attachment style (Push-pin with spring). * **82**: Specific design/geometry identifier. * **C3**: Material and Thermal Performance code. * **R0**: RoHS Compliance status (Lead-free/Compliant). --- ### 3. Electronic Design Considerations When integrating this part into a PCB design, engineers must consider several physical and thermal factors: #### A. Thermal Performance The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). * **Low Airflow (100 LFM):** 10.92 °C/W * **High Airflow (700 LFM):** 2.32 °C/W #### B. Mounting Hardware The "pushPIN™" system uses a brass or plastic pin combined with a stainless steel spring. This provides: 1. **Uniform Pressure:** Ensures consistent contact with the electronic component (CPU, GPU, or MOSFET). 2. **Vibration Resistance:** Securely holds the heat sink in place during transport or industrial operation. #### C. Thermal Interface Material (TIM) The "R0" version typically comes with a pre-applied **Thermal Interface Material** (usually a high-performance phase-change material or grease) on the base to fill microscopic air gaps between the component and the heat sink. --- ### 4. Applications This specific size (30mm x 30mm) is commonly used for: * **BGA (Ball Grid Array)** components. * Network switches and routers. * High-power LED arrays. * Embedded computing modules.