The **ATS-01B-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications Below are the primary technical parameters for the ATS-01B-86-C3-R0: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Fin Style** | Straight (Cross-cut for multi-directional airflow) | | **Thermal Resistance** | ~6.00°C/W (at 200 LFM) | | **Compatibility** | Standard 35mm BGA/FPGA packages | --- ### Key Electronic Components & Features #### 1. Heat Sink Body The body is constructed from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized finish** is not just aesthetic; it provides a layer of electrical insulation and increases emissivity, which improves heat radiation. #### 2. Attachment Mechanism (Push Pins) Instead of using adhesive tapes or clips, this model uses **Plastic Push Pins** with built-in springs. * **Purpose:** Ensures consistent pressure between the heat sink and the electronic chip. * **Advantage:** This prevents the heat sink from shifting due to vibration or thermal expansion and allows for easy removal/rework. #### 3. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the unit comes with a **Pre-applied Thermal Interface Material** (usually a phase-change material or high-performance thermal pad). This fills the microscopic air gaps between the component (CPU/GPU) and the heat sink. #### 4. Fin Geometry The fins are designed in a **cross-cut** pattern. In electronic cooling, this is critical because it allows the heat sink to be "omnidirectional," meaning it can dissipate heat effectively regardless of which direction the fan's airflow is coming from. --- ### Application in Circuit Design This part is commonly used on Printed Circuit Boards (PCBs) for: * **FPGA & ASIC Cooling:** High-speed processors that generate significant localized heat. * **Power Supplies:** Regulating temperature on MOSFETs or power ICs. * **Network Equipment:** Keeping routers and switches within operational temperature limits.