ATS-01B-87-C3-R0
AI

The **ATS-01B-87-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance "Blue Ice" heat sink family, designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs.
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### 1. Technical Specifications
The following table outlines the key physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (High Performance) |
| **Finish** | Blue Anodized |
| **Mounting Style** | Push-Pin (Plastic) |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height** | 20.00mm |
| **Fin Type** | Straight Fin |
| **Thermal Resistance** | 13.00°C/W (at 200 LFM) |
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### 2. Design Characteristics
This part is engineered for efficient heat dissipation in constrained spaces. Its design features include:
* **Heat Sink Material:** Extruded aluminum provides a lightweight solution with excellent thermal conductivity. The blue anodized finish increases surface emissivity and provides corrosion resistance.
* **Fin Geometry:** The straight-fin design is optimized for unidirectional airflow. It allows air to pass through the channels with minimal pressure drop.
* **Attachment Mechanism:** It uses a **Push-Pin** system with a compression spring. This ensures:
* Consistent pressure across the chip surface.
* Secure mechanical attachment to the PCB.
* Easy installation without specialized tools.
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### 3. Thermal Interface Material (TIM)
The "C3" suffix in the part number typically refers to the thermal interface material provided with the unit.
* **Phase Change Material:** Usually, these models come pre-applied with a high-performance thermal pad or phase-change material to ensure no air gaps exist between the heat sink and the electronic component.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **01B** | Product Series / Type |
| **87** | Specific Design/Size Reference |
| **C3** | Thermal Interface Material (TIM) Type |
| **R0** | Revision code / RoHS Compliance |
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- ⤷
What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Is there a version of this heat sink with a different attachment method like thermal tape?