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  • ATS-01B-87-C3-R0

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    The **ATS-01B-87-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance "Blue Ice" heat sink family, designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (High Performance) | | **Finish** | Blue Anodized | | **Mounting Style** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 20.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 13.00°C/W (at 200 LFM) | --- ### 2. Design Characteristics This part is engineered for efficient heat dissipation in constrained spaces. Its design features include: * **Heat Sink Material:** Extruded aluminum provides a lightweight solution with excellent thermal conductivity. The blue anodized finish increases surface emissivity and provides corrosion resistance. * **Fin Geometry:** The straight-fin design is optimized for unidirectional airflow. It allows air to pass through the channels with minimal pressure drop. * **Attachment Mechanism:** It uses a **Push-Pin** system with a compression spring. This ensures: * Consistent pressure across the chip surface. * Secure mechanical attachment to the PCB. * Easy installation without specialized tools. --- ### 3. Thermal Interface Material (TIM) The "C3" suffix in the part number typically refers to the thermal interface material provided with the unit. * **Phase Change Material:** Usually, these models come pre-applied with a high-performance thermal pad or phase-change material to ensure no air gaps exist between the heat sink and the electronic component. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01B** | Product Series / Type | | **87** | Specific Design/Size Reference | | **C3** | Thermal Interface Material (TIM) Type | | **R0** | Revision code / RoHS Compliance | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ Is there a version of this heat sink with a different attachment method like thermal tape?