The **ATS-01B-91-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | | **Flow Orientation** | Straight Fin | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand the specific configuration: * **ATS-01B**: Refers to the product series (Push-pin heat sink family). * **91**: Specific geometry/footprint code (40x40mm). * **C3**: Indicates the thermal performance class and specific material/finish combination. * **R0**: Revision or specific packaging/compliance code. --- ### 3. Key Electronic Cooling Components #### A. Thermal Interface Material (TIM) The "T412" coating on the bottom of this heat sink is a crucial "electronic part" of the assembly. It is a phase-change material that fills microscopic air gaps between the electronic chip and the aluminum base, significantly reducing thermal resistance. #### B. Attachment System (Mechanical) Unlike adhesive-based heat sinks, this model uses **Push-Pins and Springs**. * **Plastic Push-Pins:** Insert into 3.2mm holes on the PCB. * **Compression Springs:** Provide consistent downward pressure, ensuring the heat sink stays in contact with the component even during thermal expansion or vibration. #### C. Fin Design It utilizes a **straight-fin** design. In electronics cooling, this is optimized for "forced convection" (airflow provided by a fan). The spacing between fins is calculated to minimize pressure drop while maximizing the surface area for heat dissipation. --- ### 4. Typical Applications * **BGA Cooling:** Ball Grid Array components like microprocessors. * **Embedded Systems:** Industrial PCs where high-reliability mounting is required. * **Networking Gear:** Cooling chips in routers or switches that experience high temperatures.