The **ATS-01D-01-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and other high-power semiconductors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 6mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 22.05°C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties of the heat sink: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **01**: Series/Model family. * **D**: Fin Pitch/Type (High density for optimized airflow). * **01**: Dimension Identifier (Refers to the 40mm x 40mm footprint). * **C3**: Thermal Interface Material (TIM). This code indicates that a specific **Phase Change Material** or thermal pad is pre-applied to the base. * **R0**: RoHS Compliance status (Lead-free and environmentally compliant). --- ### 3. Electronic Application & Performance The ATS-01D-01-C3-R0 is engineered for **low-profile** applications where vertical space is limited (it is only 6mm high). #### Thermal Performance Chart The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 22.05 | | 200 | 1.0 | 13.18 | | 400 | 2.0 | 7.42 | | 600 | 3.0 | 5.34 | --- ### 4. Mounting Mechanism The "Push-Pin" assembly is a critical electronic hardware feature: 1. **Push-Pins:** Usually made of plastic (nylon), these snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide a precise "force" or pressure on the component, ensuring maximum contact between the chip and the heat sink base for optimal heat transfer. 3. **TIM:** The C3 designation means you do not need to apply thermal paste manually; the pre-applied pad ensures uniform thermal conductivity.