The **ATS-01D-03-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components such as BGA (Ball Grid Array) packages. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-01D-03-C2-R0 | | **Type** | Top Mount Heat Sink | | **Attachment Method** | Clip-On (superGRIP) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 9.5mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 26.20°C/W (Natural Convection) | --- ### Key Components and Design Features #### 1. The Heat Sink Body The main body is made of **Aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer. #### 2. Fin Configuration This model uses a **straight-fin** design. * **Low Profile:** At only 9.5mm height, it is ideal for systems with tight vertical clearances (such as 1U servers or slim embedded devices). * **Airflow:** It is optimized for forced air cooling (fans), though it can function in natural convection environments. #### 3. superGRIP™ Attachment Mechanism This is the most critical electronic "part" of the assembly. Instead of using permanent thermal adhesive or drilling holes in the PCB, it uses a high-strength clip system: * **Frame Clip:** A plastic frame that snaps around the component. * **Spring Clip:** A metal "C-clip" that applies constant pressure to ensure a tight thermal interface between the component and the heat sink. --- ### Thermal Performance Data Performance varies based on the Airflow Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.60 | | 400 | 2.0 | 4.40 | | 600 | 3.0 | 3.40 | | 800 | 4.0 | 2.90 | --- ### Applications The ATS-01D-03-C2-R0 is commonly found in the following electronic hardware: * **Network Switches/Routers:** Cooling ASICs and FPGAs. * **Embedded Systems:** For processors that generate moderate heat in small enclosures. * **Power Supplies:** Cooling high-speed MOSFETs or power regulators.