The **ATS-01D-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the core electronic and physical specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 18.74°C/W (Unducted Flow @ 200 LFM) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 50mm x 50mm x 10mm | | **Compatibility** | Universal (depending on hole spacing) | --- ### 2. Functional Components Electronic heat sinks like the ATS-01D-11-C2-R0 consist of several key design elements: * **The Base:** A flat aluminum surface that makes direct contact with the electronic component (usually via a Thermal Interface Material or TIM). * **The Fins:** These increase the surface area of the metal. In electronics, the larger the surface area, the more efficiently heat can be transferred to the surrounding air. * **Push-Pin Mechanism:** This part uses a spring-loaded pin to provide consistent pressure against the chip. This is critical in electronics to ensure there are no air gaps between the heat source and the sink. --- ### 3. Thermal Performance Profile In electronics design, "Thermal Resistance" is the most important metric. It measures how many degrees Celsius the component's temperature will rise for every watt of power it consumes. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 18.74 | | 400 (2.0 m/s) | 12.32 | | 600 (3.0 m/s) | 9.08 | | 800 (4.0 m/s) | 7.64 | --- ### 4. Implementation Details * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied thermal pad (e.g., Saint-Gobain C700) to bridge the microscopic gaps between the chip and the aluminum base. * **PCB Mounting:** The "Push-Pin" design requires specific holes in the Printed Circuit Board (PCB). For this model, the hole pattern is typically standardized for specific chipsets.