ATS-01D-110-C2-R1
AI

The **ATS-01D-110-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS).
Below is a detailed breakdown of its electronic and physical specifications.
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### 1. Technical Specifications
This part belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 30mm x 30mm x 25mm |
| **Thermal Resistance** | 4.42 °C/W (at 100 LFM) |
| **Weight** | 38.0 grams |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Engineering Features
#### A. Fin Profile (Straight Fin)
The "Straight Fin" design is optimized for environments with consistent airflow. This pattern maximizes surface area while maintaining a low pressure drop, allowing the heat to dissipate effectively from the base to the surrounding air.
#### B. Attachment System (pushPIN™)
Instead of adhesive tapes, this part uses a mechanical push-pin system.
* **Benefits:** Provides consistent pressure on the component (improving thermal transfer) and allows for easy removal or rework without damaging the PCB.
* **Hardware:** It typically features brass or plastic pins with stainless steel springs to ensure durability and vibration resistance.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base.
* **Function:** This fills microscopic air gaps between the heat sink and the heat-generating component (e.g., a chip), significantly reducing thermal impedance.
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### 3. Thermal Performance Data
Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure:
| Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) |
| :--- | :--- | :--- |
| 100 | 0.5 | 4.42 °C/W |
| 300 | 1.5 | 2.00 °C/W |
| 500 | 2.5 | 1.51 °C/W |
| 700 | 3.5 | 1.28 °C/W |
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### 4. Summary of Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **01D:** Product series/family
* **110:** Specific size/footprint configuration
* **C2:** Blue Anodized finish
* **R1:** Revision/Packaging code
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What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does 'Ducted' vs 'Unducted' airflow change the thermal resistance of this part?
- ⤷ Can this heat sink be used with components larger than 30mm x 30mm?