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  • ATS-01D-110-C2-R1

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    The **ATS-01D-110-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 30mm x 30mm x 25mm | | **Thermal Resistance** | 4.42 °C/W (at 100 LFM) | | **Weight** | 38.0 grams | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features #### A. Fin Profile (Straight Fin) The "Straight Fin" design is optimized for environments with consistent airflow. This pattern maximizes surface area while maintaining a low pressure drop, allowing the heat to dissipate effectively from the base to the surrounding air. #### B. Attachment System (pushPIN™) Instead of adhesive tapes, this part uses a mechanical push-pin system. * **Benefits:** Provides consistent pressure on the component (improving thermal transfer) and allows for easy removal or rework without damaging the PCB. * **Hardware:** It typically features brass or plastic pins with stainless steel springs to ensure durability and vibration resistance. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** This fills microscopic air gaps between the heat sink and the heat-generating component (e.g., a chip), significantly reducing thermal impedance. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 0.5 | 4.42 °C/W | | 300 | 1.5 | 2.00 °C/W | | 500 | 2.5 | 1.51 °C/W | | 700 | 3.5 | 1.28 °C/W | --- ### 4. Summary of Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **01D:** Product series/family * **110:** Specific size/footprint configuration * **C2:** Blue Anodized finish * **R1:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ How does 'Ducted' vs 'Unducted' airflow change the thermal resistance of this part?
    • ⤷ Can this heat sink be used with components larger than 30mm x 30mm?