The **ATS-01D-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 60mm x 60mm x 20mm | | **Thermal Resistance** | 1.80°C/W (at 200 LFM) | | **Flow Direction** | Straight Fin | --- ## 2. Component Breakdown ### A. The Heat Sink Body * **Material:** Made from high-grade aluminum, which offers a balance between thermal conductivity and lightweight properties. * **Design:** It features a **Straight Fin** design. This is optimized for uni-directional airflow (active cooling from a fan) to maximize surface area contact with moving air. * **Finish:** The "Blue Anodized" coating is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer. ### B. The Attachment System (pushPIN™) The "C2" in the part number signifies the attachment hardware. * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide "Precise Force" (approximately 20+ different options available in the series). This ensures the heat sink is pressed firmly against the chip for optimal heat transfer without cracking the silicon or the PCB. ### C. Thermal Interface Material (TIM) * The **R0** designation typically indicates that the part comes with a pre-applied high-performance thermal interface material (like a thermal pad or paste) on the base, ensuring there are no air gaps between the component and the heat sink. --- ## 3. Usage Context This part is commonly used in industrial and high-computing environments where components generate significant heat. Its 60mm footprint makes it suitable for larger integrated circuits (ICs) found in: 1. Network Switches and Routers. 2. Embedded Computing Boards. 3. Power Supply Units (PSUs).