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  • ATS-01D-151-C1-R0

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    The **ATS-01D-151-C1-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an "electronic" component in the sense of a semiconductor (like a transistor or IC), it is a critical thermal management component used to protect electronics from overheating. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | 9.37°C/W (at 100 LFM) | | **Weight** | 13.00 grams | --- ### 2. Design Characteristics The **ATS-01D-151-C1-R0** utilizes a "Fine Pitch" design which is ideal for high-density electronic boards. * **Fins:** It features straight fins designed to maximize surface area for air cooling. * **Push-Pin Attachment:** Instead of messy adhesives, this unit uses a spring-loaded push-pin mechanism. This ensures constant pressure (clamping force) for better heat transfer between the chip and the sink. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal grease or a similar phase-change material to ensure no air gaps exist between the heat sink and the component. --- ### 3. Application in Electronics This part is commonly used to cool the following electronic components: 1. **BGA Packages:** Ball Grid Array chips such as FPGAs or small CPUs. 2. **Power Converters:** Voltage regulators that generate significant heat in a small footprint. 3. **Network Switches:** Used on internal processing chips where space is limited but airflow is present. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.37 | | 300 (1.5 m/s) | 4.63 | | 500 (2.5 m/s) | 3.59 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes on heat sinks?
    • ⤷ How do I calculate the required thermal resistance for my specific electronic component?
    • ⤷ What are the advantages of push-pin mounting over adhesive thermal tape?