ATS-01D-151-C1-R0
AI

The **ATS-01D-151-C1-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an "electronic" component in the sense of a semiconductor (like a transistor or IC), it is a critical thermal management component used to protect electronics from overheating.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define the dimensions and thermal performance.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm |
| **Thermal Resistance** | 9.37°C/W (at 100 LFM) |
| **Weight** | 13.00 grams |
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### 2. Design Characteristics
The **ATS-01D-151-C1-R0** utilizes a "Fine Pitch" design which is ideal for high-density electronic boards.
* **Fins:** It features straight fins designed to maximize surface area for air cooling.
* **Push-Pin Attachment:** Instead of messy adhesives, this unit uses a spring-loaded push-pin mechanism. This ensures constant pressure (clamping force) for better heat transfer between the chip and the sink.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal grease or a similar phase-change material to ensure no air gaps exist between the heat sink and the component.
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### 3. Application in Electronics
This part is commonly used to cool the following electronic components:
1. **BGA Packages:** Ball Grid Array chips such as FPGAs or small CPUs.
2. **Power Converters:** Voltage regulators that generate significant heat in a small footprint.
3. **Network Switches:** Used on internal processing chips where space is limited but airflow is present.
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### 4. Thermal Performance Data
Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 9.37 |
| 300 (1.5 m/s) | 4.63 |
| 500 (2.5 m/s) | 3.59 |
- ⤷
What is the difference between blue anodized and black anodized finishes on heat sinks?
- ⤷ How do I calculate the required thermal resistance for my specific electronic component?
- ⤷ What are the advantages of push-pin mounting over adhesive thermal tape?