### Analysis of ATS-01D-156-C2-R0 The **ATS-01D-156-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for effective thermal management of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance (Flowing)** | 4.11 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.97 °C/W @ 400 LFM | | **Fin Style** | Straight Fin | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the specific features of the component: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **01D:** Specific series/designator for pushPIN™ attachment. * **156:** Dimensional code (40x40mm footprint). * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision/Packaging status. --- ### 3. Cooling Efficiency (Thermal Data) The efficiency of the heat sink is dependent on the airflow (measured in Linear Feet per Minute - LFM). As airflow increases, the thermal resistance decreases, allowing the component to stay cooler. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.11 | | 200 (1.0 m/s) | 2.36 | | 300 (1.5 m/s) | 1.88 | | 400 (2.0 m/s) | 1.63 | --- ### 4. Mounting Mechanism The **pushPIN™** system is a critical feature of this electronic part. It ensures: 1. **Consistent Pressure:** Pre-assembled springs provide uniform force across the thermal interface material (TIM). 2. **Security:** Plastic or brass pins snap into pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or transport. 3. **Ease of Assembly:** Reduces the risk of damaging the PCB compared to screw-down methods. --- ### 5. Application Example This part is typically used on components that generate moderate heat in a confined space. Below is a conceptual representation of how this part is integrated into a system design: ```yaml System_Integration: Component_Protected: BGA_Processor Attachment: pushPIN_with_Spring Interface: High-performance_Thermal_Pad Airflow_Requirement: Active_Fan_Cooling PCB_Hole_Pattern: 33mm_diagonal ``` ---