The **ATS-01D-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 33mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 2.41°C/W (@ 100 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Physical Design & Construction * **Form Factor:** It features a square footprint (45mm) suitable for medium-sized integrated circuits. * **Fin Density:** The "Straight Fin" design allows for efficient airflow, making it ideal for systems with directed fan cooling (forced convection). * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### 3. Mounting Mechanism (Push-Pin) This specific model uses a **Push-Pin and Spring** mounting system. This is a critical electronic part feature for the following reasons: 1. **Uniform Pressure:** The springs ensure a consistent downward force on the chip, optimizing the contact between the component and the heat sink. 2. **Ease of Assembly:** It allows for quick installation on pre-drilled PCBs (Printed Circuit Boards) without the need for specialized tools. 3. **Vibration Resistance:** The spring-loaded mechanism helps maintain thermal contact even in environments subject to mechanical shock or vibration. --- ### 4. Thermal Performance The "C2" in the part number typically refers to the thermal interface material (TIM) or specific testing parameters. The effectiveness of this part is measured by its ability to dissipate heat per watt of power generated. * **Low Airflow:** Higher thermal resistance (heat builds up faster). * **High Airflow:** Lower thermal resistance (heat is stripped away efficiently). ---