The **ATS-01D-173-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Push-Pin (Straight Fins) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Thermal Resistance** | ~4.72°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Phase Change Material) | --- ## 2. Component Breakdown ### A. Material and Coating The unit is made from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased corrosion resistance. * Improved surface emissivity for better radiant heat transfer. * Electrical insulation of the surface. ### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "C2" designation refers to a specific attachment system: * **Hole Pattern:** Designed for specific PCB layouts (typically 38mm or 43mm spacing). * **Compression Springs:** These ensure constant, even pressure on the component (TIM), maximizing heat transfer efficiency. ### C. Thermal Interface Material (TIM) This part comes pre-applied with **T766 Phase Change Material**. * **Function:** As the chip heats up, this material softens and fills microscopic air gaps between the chip and the heat sink. * **Advantage:** It offers lower thermal resistance than standard thermal pads. --- ## 3. Performance Data (Airflow) Thermal performance is dependent on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Natural) | 4.72 | | 400 | 2.95 | | 600 | 2.41 | | 800 | 2.12 | --- ## 4. Common Applications * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs in telecommunications. * **Power Electronics:** Used on VRMs (Voltage Regulator Modules). * **Embedded Systems:** Industrial PCs where space is limited but high vertical clearance (30mm) is available.