The **ATS-01D-176-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power MOSFETs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01D-176-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 6.73°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from surface-mount devices (SMD). It utilizes a **straight-fin design**, which is optimized for forced-air cooling environments (systems with fans). #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. * **Compression:** Provides consistent pressure on the electronic chip, ensuring a better thermal bond. * **Springs:** Included to ensure the heat sink remains seated during vibration or thermal expansion. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance thermal pad that fills microscopic air gaps between the component die and the aluminum base, significantly reducing thermal resistance. --- ### 3. Dimensional Drawing (Reference) While actual CAD files are required for manufacturing, the layout generally follows this structure: ```text 35.00 mm [1.38"] <---------------> _________________ ^ | || || || || || | | 15.00 mm [0.59"] |_||_||_||_||_||_| v [________________] (Base) ``` --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Networking:** Cooling ASICs in switches and routers. * **Power Electronics:** Managing heat for voltage regulators and power converters.