Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-01D-184-C2-R0

  • AI
    The **ATS-01D-184-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic assemblies where space and airflow are critical factors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Pitch** | 1.14mm (Fine Pitch) | | **Thermal Resistance (Unducted)** | 4.14 °C/W @ 100 LFM | | **Weight** | ~48 grams | --- ### 2. Key Electronic & Mechanical Components #### A. Thermal Interface Material (TIM) The base of the ATS-01D-184-C2-R0 comes pre-applied with **T766 Phase Change Material**. * **Function:** It fills microscopic air gaps between the heat source (CPU, GPU, or MOSFET) and the heat sink base to maximize heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical fastening system: * **Brass Components:** The pins are often made of brass for durability. * **Stainless Steel Springs:** Provide consistent pressure (clamping force) to ensure the heat sink remains in contact with the electronic component under vibration or thermal expansion. #### C. Fin Geometry The "C2" in the part number indicates a specific fin design: * **High-Efficiency Flow:** The fins are spaced to allow for "fine pitch" cooling, making it ideal for systems with forced-air cooling (fans) rather than passive convection. --- ### 3. Typical Applications This heat sink is commonly found protecting the following electronic parts: 1. **BGA Packages:** Ball Grid Array chips used in networking gear. 2. **Power Semiconductors:** High-voltage regulators that generate significant heat. 3. **Embedded Systems:** Industrial PCs where mechanical stability (via push-pins) is required over long periods. --- ### 4. Part Number Breakdown (Example) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **01D:** Series designation * **184:** Specific dimensions/fin configuration * **C2:** Thermal Interface Material / Performance grade * **R0:** RoHS compliant (environmental safety standard)
    ✨ Follow-up Questions
    • ⤷ What are the benefits of pushPIN™ over traditional adhesive thermal tape?
    • ⤷ How does the 4.14 °C/W thermal resistance change with higher airflow (LFM)?
    • ⤷ Is this heat sink compatible with standard 40mm mounting hole patterns?