ATS-01D-184-C2-R0
AI

The **ATS-01D-184-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic assemblies where space and airflow are critical factors.
---
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Pitch** | 1.14mm (Fine Pitch) |
| **Thermal Resistance (Unducted)** | 4.14 °C/W @ 100 LFM |
| **Weight** | ~48 grams |
---
### 2. Key Electronic & Mechanical Components
#### A. Thermal Interface Material (TIM)
The base of the ATS-01D-184-C2-R0 comes pre-applied with **T766 Phase Change Material**.
* **Function:** It fills microscopic air gaps between the heat source (CPU, GPU, or MOSFET) and the heat sink base to maximize heat transfer.
#### B. The pushPIN™ Attachment System
Instead of using messy adhesives or thermal tape, this part uses a mechanical fastening system:
* **Brass Components:** The pins are often made of brass for durability.
* **Stainless Steel Springs:** Provide consistent pressure (clamping force) to ensure the heat sink remains in contact with the electronic component under vibration or thermal expansion.
#### C. Fin Geometry
The "C2" in the part number indicates a specific fin design:
* **High-Efficiency Flow:** The fins are spaced to allow for "fine pitch" cooling, making it ideal for systems with forced-air cooling (fans) rather than passive convection.
---
### 3. Typical Applications
This heat sink is commonly found protecting the following electronic parts:
1. **BGA Packages:** Ball Grid Array chips used in networking gear.
2. **Power Semiconductors:** High-voltage regulators that generate significant heat.
3. **Embedded Systems:** Industrial PCs where mechanical stability (via push-pins) is required over long periods.
---
### 4. Part Number Breakdown (Example)
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **01D:** Series designation
* **184:** Specific dimensions/fin configuration
* **C2:** Thermal Interface Material / Performance grade
* **R0:** RoHS compliant (environmental safety standard)
- ⤷
What are the benefits of pushPIN™ over traditional adhesive thermal tape?
- ⤷ How does the 4.14 °C/W thermal resistance change with higher airflow (LFM)?
- ⤷ Is this heat sink compatible with standard 40mm mounting hole patterns?