The **ATS-01D-187-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.52°C/W (at 200 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Features * **maxiFLOW™ Geometry:** The fins are designed with a graduated "spread" to maximize surface area while maintaining low pressure drop. This is ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy thermal glue, this uses two plastic or brass pins and a spring mechanism. This ensures consistent pressure across the chip for better thermal transfer. * **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with a high-performance phase-change material or grease already applied to the base, simplifying assembly. --- ### 3. Thermal Performance Profile Thermal resistance indicates how effectively the part moves heat away from the component. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.52 | | 300 (1.5 m/s) | 2.02 | | 400 (2.0 m/s) | 1.77 | | 500 (2.5 m/s) | 1.60 | --- ### 4. Applications This part is commonly used in: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators.