The **ATS-01D-188-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Property | Value / Detail | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Fine Pitch (straight fins for directional airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. In electronics, the TIM is crucial because it fills the microscopic air gaps between the heat sink and the component (like a processor), ensuring maximum heat transfer. #### B. Attachment System: Push Pin & Spring Unlike adhesive-based heat sinks, the `C2-R0` uses a mechanical fastening system: * **Push Pins:** Brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent "downward force" (pressure), preventing the heat sink from shifting and maintaining optimal contact with the electronic chip. #### C. Aluminum 6063 Alloy The use of AL6063 is standard in high-end electronics cooling because it offers a high thermal conductivity-to-weight ratio, ensuring the component doesn't add excessive weight to the circuit board while dissipating heat effectively. --- ### 3. Application Use Cases * **Telecommunications:** Cooling for network switches and routers. * **Power Electronics:** Dissipating heat from high-current transistors (MOSFETs). * **Embedded Systems:** Ideal for ARM or FPGA processors that operate in environments with forced air (fan-cooled). --- ### 4. Thermal Performance Data *Data represents temperature rise over ambient per Watt:* * **Unducted Airflow (200 LFM):** 6.67 °C/W * **Unducted Airflow (400 LFM):** 3.51 °C/W * **Unducted Airflow (600 LFM):** 2.72 °C/W