The **ATS-01D-193-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimension (L x W)** | 40mm x 40mm | | **Height (Fin Height)** | 10mm | | **Mounting Type** | Push-Pin (Brass) | | **Attachment Style** | Spring-loaded | | **Thermal Resistance** | 21.11°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Electronic Components While the heatsink itself is mechanical, it consists of several sub-parts designed for electronic integration: * **Heat Sink Body:** Features a "Fine Pitch" or "Cross-Cut" design. The large surface area allows for efficient heat transfer from the semiconductor die to the surrounding air. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. TIM is a phase-change material that fills microscopic air gaps between the chip and the heatsink to improve conductivity. * **Push-Pin & Spring Assembly:** These are the mechanical fasteners. The springs ensure "Constant Pressure," which is critical in electronics to prevent the heatsink from shifting during thermal expansion or vibration. --- ### 3. Usage in Electronic Design When engineers select the **ATS-01D-193-C2-R0**, they look at the following performance metrics relative to the PCB: 1. **Thermal Performance:** * **At 200 LFM (Linear Feet per Minute):** Resistance drops to ~10.0°C/W. * **At 500 LFM:** Resistance drops further to ~6.0°C/W. 2. **Hole Pattern:** The part requires specific drill holes in the PCB. For this model, the pitch is typically **45mm x 45mm** (though it fits a 40mm chip). 3. **Low Profile:** At only 10mm height, it is ideal for high-density electronic enclosures or 1U server racks where vertical space is limited. --- ### 4. Application Examples * **Voltage Regulator Modules (VRMs):** Cooling power delivery phases. * **Embedded Systems:** Industrial PCs where fanless cooling is supplemented by chassis airflow. * **Networking Equipment:** Routers and switches that use high-speed ASICs.