The **ATS-01D-197-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and high-density power modules. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass, 4.3mm) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 10.90°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Physical Design Features #### A. Fin Pattern (Cross-Cut) The unit features a **straight fin** or **cross-cut** design. This is engineered to maximize surface area while allowing for multi-directional airflow, which is critical in compact electronic enclosures where air may not move in a single linear path. #### B. Attachment Mechanism * **Push-Pins:** These provide a secure and reliable mechanical attachment to the Printed Circuit Board (PCB). * **Springs:** The compression springs ensure a consistent and uniform pressure between the heat sink and the electronic chip, optimizing thermal transfer. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Applications This specific part is typically found in: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PC boards and controllers. * **Power Supplies:** Voltage regulator modules (VRMs) and MOSFET arrays. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 10.90 | | 400 | 2.0 | 7.70 | | 600 | 3.0 | 6.30 |