The **ATS-01D-209-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for electronic cooling applications where thermal resistance and space efficiency are critical. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Mounting Type** | pushPIN™ (Brass Springs) | | **Attachment Hole Pattern** | Square (63mm x 63mm) | | **Thermal Resistance (Unducted)** | 6.27 °C/W @ 100 LFM | | **Fin Style** | Straight (Cross-Cut) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Features and Construction ### A. Material and Finish * **Aluminum 6063:** The core is made of a high-conductivity aluminum alloy. * **Blue Anodized:** The surface is treated to resist corrosion and slightly improve emissivity for radiative cooling. ### B. Thermal Performance The efficiency of this heat sink depends on the airflow (velocity measured in Linear Feet per Minute - LFM): * **Low Flow (100 LFM):** ~6.27 °C/W resistance. * **High Flow (700 LFM):** ~1.73 °C/W resistance. * *Interpretation:* At high airflow, the heat sink can dissipate significantly more heat per degree of temperature rise. ### C. Attachment Mechanism (pushPIN™) Unlike simple adhesive tapes, this part uses a mechanical **pushPIN™** system: * **Constant Pressure:** A brass spring provides consistent force between the heat sink and the component (CPU/GPU/FPGA). * **Reliability:** This ensures better thermal contact and prevents the heat sink from shifting during vibration or shipping. --- ## 3. Comparison with Similar Profiles Below is a brief comparison of the ATS-209 series variations: | Part Number | Height | Finish | Attachment | | :--- | :--- | :--- | :--- | | **ATS-01D-209-C1-R0** | 10mm | Blue Anodized | pushPIN™ (Plastic) | | **ATS-01D-209-C2-R0** | 10mm | Blue Anodized | pushPIN™ (Brass) | | **ATS-01D-209-C3-R0** | 10mm | Blue Anodized | pushPIN™ (Stainless) | --- ## 4. Typical Applications * **Embedded Systems:** Cooling for ARM-based processors or FPGAs. * **Telecommunications:** Cooling of networking chips on PCBs. * **Power Electronics:** Dissipating heat from high-power MOSFETs or VRMs.