The **ATS-01D-30-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | Push-Pin (Fine Pitch) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 25mm | | **Attachment Method** | Push-Pin with Brass Springs | | **Thermal Resistance** | 5.35°C/W (at 200 LFM) | | **Flow Direction** | Vertical/Horizontal (Omni-directional fins) | --- ### 2. Key Design Components #### A. Fine Pitch Fin Design The "D" in the part number often refers to the fin density or pattern. This model features a high-density fin array which increases the surface area for heat exchange without significantly increasing the footprint of the device. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or tapes, this part uses a mechanical attachment system: * **Push-Pins:** Plastic or metal pins that snap into pre-drilled holes on the PCB. * **Springs:** Provides consistent downward pressure (clamping force) to ensure maximum contact between the component and the heat sink. #### C. Thermal Interface Material (TIM) The **-C3** suffix indicates that the unit comes pre-applied with a high-performance thermal interface material (typically a phase-change material or thermal grease). This eliminates the need for manual application and ensures air gaps are filled for better conductivity. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its properties: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **01D**: Series designation (Push-pin style). 3. **30**: Width/Length in millimeters (30x30mm). 4. **C3**: Thermal Interface Material type (Pre-applied). 5. **R0**: RoHS Compliance status (Lead-free). --- ### 4. Application Use-Case This part is typically used in: * **Telecommunications:** Cooling high-speed processors in routers. * **Embedded Systems:** Industrial PCs where vibration resistance is needed (push-pins are more secure than adhesive). * **Power Supplies:** Cooling voltage regulators.