The **ATS-01D-33-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **pushPIN™** series and is designed for electronic cooling at the component level (CPUs, GPUs, and other high-heat integrated circuits). --- ## 1. Technical Specifications The following table breaks down the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.83 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 17.61 °C/W (Unducted) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Hole Pattern** | Square | --- ## 2. Component Features ### A. Material and Design * **Aluminum Construction:** Utilizes 6063 aluminum for high thermal conductivity while remaining lightweight. * **Fin Configuration:** Features a cross-cut (pin-fin) design. This maximizes surface area and allows for airflow from multiple directions, making it ideal for systems with variable air patterns. * **Blue Anodizing:** The surface treatment provides corrosion resistance and increases thermal emissivity, slightly improving heat radiation. ### B. Attachment Mechanism (pushPIN™) The part uses a specialized attachment system consisting of: 1. **Plastic/Brass Push Pins:** Designed to quickly snap into pre-drilled holes in the Printed Circuit Board (PCB). 2. **Compression Springs:** These provide a consistent, calculated pressure (force) against the electronic component to ensure optimal thermal interface contact. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the heat sink comes with **T766** pre-applied thermal interface material (or similar), ensuring high-efficiency heat transfer from the chip to the aluminum base. --- ## 3. Usage Context | Application | Benefit | | :--- | :--- | | **Server/Networking** | Handles high-density components in 1U/2U racks. | | **Power Electronics** | Cools MOSFETs and power regulators. | | **Embedded Systems** | Small footprint with robust mechanical attachment for high-vibration environments. | --- ## 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions) * **01D:** Product Series (pushPIN™) * **33:** Fin Pitch/Height Code * **C3:** Material/Finish Code (Aluminum, Blue Anodized) * **R0:** Thermal Interface Material & Revision