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  • ATS-01D-35-C3-R0

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    The **ATS-01D-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* Below is a detailed breakdown of its specifications, electronic application, and physical characteristics. ### 1. Technical Specifications This heat sink is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic environments. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.35°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.42°C/W | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Key Electronic Components From an engineering perspective, this part consists of three primary sub-components: #### A. The Heat Sink Body Made from extruded aluminum, the base absorbs heat from the semiconductor (CPU, GPU, or MOSFET). The fine-pitch fins increase the surface area, allowing air to carry heat away via convection. #### B. The pushPIN™ Attachment Unlike adhesive tapes, this uses a mechanical attachment system. It consists of: * **Push Pins:** Durable brass or plastic pins that lock into the PCB. * **Compression Springs:** Provide consistent "TIM" (Thermal Interface Material) pressure to ensure no air gaps exist between the chip and the metal. #### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes that the part comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad on the base, ensuring maximum heat transfer efficiency from the component. --- ### 3. Application Use Cases This specific part is typically used for cooling the following electronic hardware: * **Northbridge/Southbridge Chipsets:** Found on motherboards. * **FPGA & ASICs:** High-speed processing units in networking gear. * **LED Arrays:** High-power industrial lighting. * **Power Converters:** Managing heat in DC-DC voltage regulators. --- ### 4. Installation Code Structure In a professional Bill of Materials (BOM), the part number is decoded as follows: `ATS` (Brand) - `01` (Series) - `D` (Spring Type) - `35` (Width) - `C3` (Fin Pitch/Length) - `R0` (Material/Finish/TIM).
    ✨ Follow-up Questions
    • ⤷ What is the difference between active and passive cooling for this heat sink?
    • ⤷ How do I calculate if the 1.35°C/W thermal resistance is sufficient for my chip?
    • ⤷ What PCB hole diameter is required for the pushPIN attachment?