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The **ATS-01D-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.*
Below is a detailed breakdown of its specifications, electronic application, and physical characteristics.
### 1. Technical Specifications
This heat sink is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic environments.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Flowing)** | 1.35°C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 4.42°C/W |
| **Dimensions (L x W x H)** | 35mm x 35mm x 10mm |
| **Fin Pattern** | Fine Pitch (Straight Fin) |
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### 2. Key Electronic Components
From an engineering perspective, this part consists of three primary sub-components:
#### A. The Heat Sink Body
Made from extruded aluminum, the base absorbs heat from the semiconductor (CPU, GPU, or MOSFET). The fine-pitch fins increase the surface area, allowing air to carry heat away via convection.
#### B. The pushPIN™ Attachment
Unlike adhesive tapes, this uses a mechanical attachment system. It consists of:
* **Push Pins:** Durable brass or plastic pins that lock into the PCB.
* **Compression Springs:** Provide consistent "TIM" (Thermal Interface Material) pressure to ensure no air gaps exist between the chip and the metal.
#### C. Thermal Interface Material (TIM)
The "R0" suffix usually denotes that the part comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad on the base, ensuring maximum heat transfer efficiency from the component.
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### 3. Application Use Cases
This specific part is typically used for cooling the following electronic hardware:
* **Northbridge/Southbridge Chipsets:** Found on motherboards.
* **FPGA & ASICs:** High-speed processing units in networking gear.
* **LED Arrays:** High-power industrial lighting.
* **Power Converters:** Managing heat in DC-DC voltage regulators.
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### 4. Installation Code Structure
In a professional Bill of Materials (BOM), the part number is decoded as follows:
`ATS` (Brand) - `01` (Series) - `D` (Spring Type) - `35` (Width) - `C3` (Fin Pitch/Length) - `R0` (Material/Finish/TIM).
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What is the difference between active and passive cooling for this heat sink?
- ⤷ How do I calculate if the 1.35°C/W thermal resistance is sufficient for my chip?
- ⤷ What PCB hole diameter is required for the pushPIN attachment?