The **ATS-01D-41-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~10.07° C/W (Natural Convection) | | **Compatibility** | Standard PCB hole patterns | --- ### 2. Core Electronic/Thermal Components The assembly consists of three main electronic packaging elements: #### A. The Heatsink Body * **Geometry:** Features a vertical fin array designed for both natural and forced air convection. * **Material Science:** Constructed from 6063 aluminum. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection and slightly increases emissivity for better radiant heat transfer. #### B. The Push-Pin Mechanism * **Function:** Ensures consistent pressure between the heatsink base and the electronic component (IC). * **Spring Rate:** The "R0" series uses specific spring tensions to ensure optimal **Interface Pressure**, which is critical for minimizing the air gaps between the chip and the metal. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model usually comes with a pre-applied thermal pad or phase-change material on the base. This fills the microscopic air gaps between the electronic package and the heatsink. --- ### 3. Application Use Cases In electronic design, this part is typically used for: 1. **High-Density PCBs:** Where space is limited but vertical height allows for 25mm clearance. 2. **Network Switches:** Cooling ASICs or processors that generate moderate heat. 3. **Power Supplies:** Managing heat for MOSFET arrays or voltage regulators. --- ### 4. Thermal Performance Comparison *At varying airflow speeds (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.20 | | 400 (2.0 m/s) | 2.10 | | 600 (3.0 m/s) | 1.60 | ---