The **ATS-01D-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Component Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Resistance** | 2.73°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Fin Style** | Straight Fin (provides high surface area) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **ATS-01D-49-C3-R0** uses a mechanical push-pin system. This provides: * **Constant Pressure:** Ensures optimal contact between the component and the heat sink. * **Reliability:** Resistant to vibrations and thermal expansion cycles that might cause adhesives to fail. * **Ease of Rework:** Can be removed and re-installed without cleaning messy glue. #### B. Thermal Interface Material (T412) The "C3" in the part number indicates the presence of **T412 thermal tape**. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** Reduces contact resistance, allowing heat to flow efficiently from the silicon to the aluminum fins. #### C. Aluminum Construction (Blue Anodized) * **Thermal Conductivity:** High efficiency in transferring heat. * **Anodization:** The blue coating is not just for aesthetics; it provides electrical insulation and corrosion resistance, preventing short circuits if the sink accidentally touches nearby components. --- ### 3. Typical Use Cases This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Industrial PCs:** Cooling embedded CPU modules. 3. **Power Supplies:** Managing heat for MOSFETs or voltage regulators.