The **ATS-01D-77-C3-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 9.58°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (Straight) | --- ### Component Breakdown #### 1. Push-pin Attachment Mechanism The "01D" and "R0" designations often refer to the specific mounting hardware. This model utilizes a **push-pin and brass spring** system. - **Benefit:** It provides a consistent, high-pressure contact between the heat sink and the electronic chip. - **Ease of Use:** It simplifies assembly on a PCB (Printed Circuit Board) compared to adhesive tapes. #### 2. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of thermal interface material pre-applied to the base of the heat sink. - **Type:** T412. - **Function:** This is a high-performance phase-change material or thermal grease that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. #### 3. Airflow Efficiency The "77" series uses a **fine-pitch fin design**. - In electronic cooling, this design increases the surface area available for convection. - It is optimized for "forced air" environments (where a fan is present) rather than passive cooling. #### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. - **Protection:** It prevents corrosion and oxidation of the aluminum. - **Radiation:** Anodized surfaces slightly improve the emissivity of the metal, allowing for better heat radiation. --- ### Use Cases in Electronics This part is typically found in: * **Networking Equipment:** Routers, switches, and small-form-factor servers. * **Embedded Systems:** Industrial PCs where high-density components generate significant heat. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. ---