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  • ATS-01D-78-C2-R0

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    ## Electronic Part Specification: ATS-01D-78-C2-R0 The **ATS-01D-78-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient thermal management in electronic systems like CPUs, GPUs, or power components. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-01D-78-C2-R0 | | **Type** | Top Mount Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 25mm | | **Fin Style** | Fine Pitch (Straight) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Data The efficiency of this part is measured by its thermal resistance ($^\circ\text{C/W}$), which determines how well it dissipates heat based on airflow (LFM - Linear Feet per Minute). | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 7.71 $^\circ\text{C/W}$ | 3.12 $^\circ\text{C/W}$ | | 200 (1.0 m/s) | 3.12 $^\circ\text{C/W}$ | 2.02 $^\circ\text{C/W}$ | | 400 (2.0 m/s) | 1.83 $^\circ\text{C/W}$ | 1.47 $^\circ\text{C/W}$ | --- ### 3. Key Features and Components * **PushPIN™ Technology:** Uses a flexible attachment system consisting of a brass or plastic pin and a compression spring. This ensures a secure fit and constant pressure for optimal heat transfer. * **High Aspect Ratio:** The "Fine Pitch" design provides a larger surface area within a small footprint, maximizing cooling efficiency in cramped PCB environments. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling. * **Pre-Applied TIM:** Comes with **T766 thermal interface material**, which eliminates the need for manual thermal paste application during assembly. ### 4. Application Usage This specific part is ideal for: 1. **Compact Electronics:** Small form factor networking gear or industrial controllers. 2. **Embedded Systems:** Cooling high-speed microprocessors or FPGAs. 3. **Prototyping:** The pushPIN system allows for easy installation and removal without specialized tools.
    ✨ Follow-up Questions
    • ⤷ What are the mechanical mounting hole requirements for the pushPIN system?
    • ⤷ How does the T766 thermal interface material compare to other TIM options?
    • ⤷ Are there custom height variations available for the 25x25mm base?