ATS-01D-78-C2-R0
AI

## Electronic Part Specification: ATS-01D-78-C2-R0
The **ATS-01D-78-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient thermal management in electronic systems like CPUs, GPUs, or power components.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-01D-78-C2-R0 |
| **Type** | Top Mount Heat Sink |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 25mm x 25mm x 25mm |
| **Fin Style** | Fine Pitch (Straight) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Thermal Performance Data
The efficiency of this part is measured by its thermal resistance ($^\circ\text{C/W}$), which determines how well it dissipates heat based on airflow (LFM - Linear Feet per Minute).
| Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 7.71 $^\circ\text{C/W}$ | 3.12 $^\circ\text{C/W}$ |
| 200 (1.0 m/s) | 3.12 $^\circ\text{C/W}$ | 2.02 $^\circ\text{C/W}$ |
| 400 (2.0 m/s) | 1.83 $^\circ\text{C/W}$ | 1.47 $^\circ\text{C/W}$ |
---
### 3. Key Features and Components
* **PushPIN™ Technology:** Uses a flexible attachment system consisting of a brass or plastic pin and a compression spring. This ensures a secure fit and constant pressure for optimal heat transfer.
* **High Aspect Ratio:** The "Fine Pitch" design provides a larger surface area within a small footprint, maximizing cooling efficiency in cramped PCB environments.
* **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling.
* **Pre-Applied TIM:** Comes with **T766 thermal interface material**, which eliminates the need for manual thermal paste application during assembly.
### 4. Application Usage
This specific part is ideal for:
1. **Compact Electronics:** Small form factor networking gear or industrial controllers.
2. **Embedded Systems:** Cooling high-speed microprocessors or FPGAs.
3. **Prototyping:** The pushPIN system allows for easy installation and removal without specialized tools.
- ⤷
What are the mechanical mounting hole requirements for the pushPIN system?
- ⤷ How does the T766 thermal interface material compare to other TIM options?
- ⤷ Are there custom height variations available for the 25x25mm base?