The **ATS-01D-79-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic cooling component designed to dissipate heat from integrated circuits (ICs) and other heat-generating electronic parts. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Description / Value | | :--- | :--- | | **Part Number** | ATS-01D-79-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Dimensions** | 25.0mm x 25.0mm x 30.0mm | | **Thermal Resistance** | 26.55 °C/W (Natural Flow) | | **Fin Style** | Straight Fin | --- ### 2. Design and Construction * **Material (Aluminum):** Provides a high strength-to-weight ratio and excellent thermal conductivity, facilitating the rapid transfer of heat from the component to the air. * **Fin Geometry:** The "Straight Fin" design is optimized for high-density airflow. The 30mm height allows for a larger surface area, which improves heat dissipation efficiency. * **Blue Anodized Finish:** The surface treatment is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. ### 3. Mounting Mechanism (Push-Pin) The "Push-Pin" system is a critical electronic hardware feature: 1. **Brass/Plastic Pins:** Used to secure the heat sink to pre-drilled holes in the Printed Circuit Board (PCB). 2. **Compression Springs:** These provide a consistent, specific downward pressure (preload). This ensures that the interface between the heat sink and the chip is tight, minimizing the **Thermal Interface Resistance**. 3. **Reliability:** Unlike adhesive tapes, push-pins offer a more secure mechanical bond, especially in high-vibration environments. ### 4. Application Use Cases This specific part is generally used in compact electronic systems where PCB real estate is limited but vertical height is available: * **Telecom Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or small MOSFET arrays. ---