The **ATS-01D-80-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat-generating ICs. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 7.21°C/W (at 100 LFM) | | **Fin Style** | Straight | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### ### Key Components & Features 1. **Material and Finish:** * Constructed from **Aluminum** to balance weight and thermal conductivity. * The **Blue Anodized** finish provides better surface protection and emissivity compared to raw aluminum. 2. **Mounting System (Push-Pins):** * This part uses a **Brass Push-Pin** mechanism with a compression spring. This ensures consistent pressure on the heat source, which is critical for maximizing thermal transfer. * The "D" in the part number refers to a specific hole pattern/spacing (standard 2-hole mount). 3. **Fin Design:** * The vertical straight fins are optimized for both natural convection and forced-air cooling. * The spacing is designed to minimize pressure drop while maximizing the surface area for heat dissipation. 4. **Pre-Applied TIM (Thermal Interface Material):** * It comes with **T412** thermal tape or paste pre-applied. This eliminates the need for manual application, ensuring a clean and reliable thermal bond between the chip and the heat sink. --- ### ### Typical Applications * **Networking Equipment:** Routers, switches, and bridges. * **Industrial PCs:** Compact systems where vertical space allows for a 25mm height. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **FPGA & ASICs:** Cooling high-speed processing chips. --- ### ### Comparative Thermal Performance *Values are approximate based on air flow (LFM - Linear Feet per Minute):* | Air Flow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 7.21 | | 200 | 4.63 | | 400 | 3.25 |