The **ATS-01D-82-C3-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "maxiFLOW™" product line. --- ### 1. Technical Specifications The part is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips, CPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01D-82-C3-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW™ (Tapered fin design) | --- ### 2. Key Electronic Features #### A. The maxiFLOW™ Fin Geometry Unlike standard rectangular heat sinks, this part uses a **tapered fin design**. This increases the surface area for heat exchange and reduces the pressure drop as air flows through the fins. In electronics, this allows for better cooling in systems with low airflow (LFM). #### B. pushPIN™ Attachment System The "01D" in the part number signifies the attachment style. It uses a **pushPIN™ system** which includes: * **Compression Springs:** Provides precise pressure on the electronic component to ensure high thermal conductivity. * **Brass/Plastic Pins:** Securely locks the heat sink into pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The suffix **C3** typically indicates that the part comes pre-applied with a high-performance thermal interface material (like Phase Change Material). This eliminates the need for manual application of thermal paste during the assembly of the electronic device. --- ### 3. Application Use Cases This component is typically found in high-density electronic environments where space is limited but heat generation is high: * **Telecommunications:** Routers, switches, and base stations. * **Industrial PC:** Embedded boards and control systems. * **Consumer Electronics:** High-end audio processors or specialized GPU units. --- ### 4. Thermal Performance Data *Measured at various air velocities (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 3.50 | | 200 | 2.50 | | 300 | 2.10 | | 400 | 1.85 |